Thermal Considerations for Sensors
Any component with a physical contact to a power source or path produces heat. Integrated current sensors are no exceptions. When applied in the circuit, it is necessary to allocate additional surface area on power boards to dissipate the generated heat. The additional surface area can be 5-10 times the size of the sensor as recommended by traditional manufacturers - see the figure. Tell-i non-invasive and contactless current sensors do not generate such heat. Hence, no additional space on board is required. Tell-i sensors are developed to address the need for high frequency ultra power-dense applications. Please contact us at info@tell-i.com.
